Very sad. I seriously hate Intel HSF push pin style. My motherboard is bend now.

Like the picture below, dented mobo:

Also, my temperature rises up to 44C during idle time. At average load, the temperature is near 60C. This is consider relatively high for my E4700 since I have not overclock the CPU yet.

I am definitely going to change my PC casing since it pretty sucks big time. The PSU is SUPER NEAR my mobo. I have heat dissipation problem too because of the lousy casing structure. Don’t ask me why I get this casing last time.

I am also going to get a LGA775 back-plate for my mobo, eliminating push-pin style! Moreover, I am considering to buy CoolerMaster Hyper 212 Heat Sink Fan to replace my stock HSF. I hope all these will change my temperature.

If everything is success, I will also try overclocking my E4700 to 3.0Ghz. This will certainly improve my computer “horsepower”!

Below video is not a C2D stock heatsink, but somewhat it resemble the shape. It is hard to apply the thermal paste because of the circular shape of the heat sink.

See the jitpun kia do:

Lastly, thanks xiao ming a zillion for lending me his thermal paste. Now my computer is okay

As time goes by, the thermal paste residing below the CPU will get dried out and thus, resulting in a poor heat management.

Buying a thermal paste and applying it yourself is the best and inexpensive way of doing it. Below is a guide on applying the thermal paste onto different Intel CPU:

http://www.arcticsilver.com/ins_route_step2intelas5.html